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 EliteMT
DRAM
FEATURES
X16 organization EDO (Extended Data-Output) access mode 2 CAS Byte/Word Read/Write operation Single 5V ( 10%) power supply TTL-compatible inputs and outputs 512-cycle refresh in 8ms Refresh modes : RAS only, CAS BEFORE RAS (CBR) and HIDDEN JEDEC standard pinout Key AC Parameter tRAC -25 -28 -30 -35 -40 25 28 30 35 40 tCAC 8 9 9 10 11 tRC 43 48 55 65 75 tPC 10 11 12 14 16
M11B416256A 256 K x 16 DRAM
EDO PAGE MODE
ORDERING INFORMATION - PACKAGE
40-pin 400mil SOJ 44 / 40-pin 400mil TSOP (TypeII)
PRODUCT NO. M11B416256A-25J M11B416256A-28J M11B416256A-30J M11B416256A-35J M11B416256A-40J M11B416256A-25T M11B416256A-28T M11B416256A-30T M11B416256A-35T M11B416256A-40T
PACKING TYPE SOJ
TSOPII
GENERAL DESCRIPTION
The M11B416256A is a randomly accessed solid state memory, organized as 262,144 x 16 bits device. It offers Extended Data-Output , 5V( 10%) single power supply. Access time (-25,-28,-30,-35,-40) and package type (SOJ, TSOP II) are optional features of this family. All these family have CAS - before - RAS , RAS -only refresh and Hidden refresh capabilities. Two access modes are supported by this device : Byte access and Word access. Use only one of the two CAS and leave the other staying high will result in a BYTE access. WORD access happens when two CAS ( CASL , CASH ) are used.
CASL transiting low during READ or WRITE cycle will output or input data into the lower byte (IO0~IO7), and CASH transiting low will output or input data into the upper byte (IO8~15).
PIN ASSIGNMENT
SOJ Top View
VCC I/O0 I/O1 I/O2 I/O3 VCC I/O4 I/O5 I/O6 I/O7 NC NC WE RA S NC A0 A1 A2 A3 VCC
TSOP (TypeII) Top View
VS S I/O1 5 I/O1 4 I/O1 3 I/O1 2 VS S I/O1 1 I/O1 0 I/O9 I/O8 NC CASL CASH OE A8 A7 A6 A5 A4 VS S
VCC I/O0 I/O1 I/O2 I/O3 VCC I/O4 I/O5 I/O6 I/O7 NC NC WE RA S NC A0 A1 A2 A3 VCC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
VS S I/O1 5 I/O1 4 I/O1 3 I/O1 2 VS S I/O1 1 I/O1 0 I/O 9 I/O 8 NC CASL CASH OE A8 A7 A6 A5 A4 VS S
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 1/15
EliteMT
FUNCTIONAL BLOCK DIAGRAM
M11B416256A
WE RAS CASL CASH CONTROL LOGIC
DATA-IN BUFFER 16 IO0 : IO15
CLOCK GENERATOR COLUMN DECODER 512 16
DATA-OUT BUFFER OE 16 9
9 A0 A1 A2 A3 A4 A5 A6 A7 A8 9
COLUMN ADDRESS BUFFER
REFRESH CONTROLER
SENSE AMPLIFIERS I/O GATING 8 512 x 16
REFRESH COUNTER 99 ROW. ADDRESS BUFFERS(9) 9 ROW DECODER 512 x 512 x 16 MEMORY ARRAY
512
VBB GENERATOR
VCC VSS
PIN DESCRIPTIONS
PIN NO. 16~19,22~26 14 28 29 13 PIN NAME A0~A8
RAS CASH CASL
TYPE Input Input Input Input
DESCRIPTION Address Input Row Address : A0~A8 Column Address : A0~A8 Row Address Strobe Column Address Strobe / Upper Byte Control Column Address Strobe / Lower Byte Control
WE
OE
Input Input Input / Output Supply Ground -
Write Enable Output Enable Data Input / Output Power, 5V Ground No Connect
27 2~5,7~10,31~34,36~39 1,6,20 21,35,40 11,12,15,30
I/O0 ~ I/O15 VCC VSS NC
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 2/15
EliteMT
ABSOLUTE MAXIMUM RATINGS
Voltage on Any pin Relative to Vss ... ......-1V to +7V Operating Temperature, TA (ambient) ....0 C to +70 C Storage Temperature (plastic) ..........-55 C to +150 C Power Dissipation .......................................1.43W Short Circuit Output Current ........................50mA
M11B416256A
Permanent device damage may occur if "Absolute Maximum Ratings" are exceeded. This is a stress rating only, and functional operation of the device above those conditions indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
DC ELECTRICAL CHARACTERISTICS AND RECOMMENDED OPERATING CONDITIONS (0 C TA 70 C ; VCC = 5V 10% unless otherwise noted)
PARAMETER CONDITIONS SYMBOL MIN MAX UNITS NOTES
Supply Voltage Supply Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage Note : 1.All Voltages referenced to VSS 0V VIN VIH (max) 0V VOUT VCC Output(s) disable IOH = -5 mA IOL = 4.2 mA
VCC VSS VIH VIL ILI ILO VOH VOL
4.5 0 2.4 -0.3 -10 -10 2.4 -
5.5 0 VCC +0.3 0.8 10 10 0.4
V V V V
A A
1
1 1
V V
PARAMETER
CONDITIONS
RAS , CAS cycling , tRC =min
SYMBOL
MAX -25 -28 -30 -35 -40
UNITS NOTES
Operating Current Standby Current
RAS only refresh Current
ICC1 ICC2 ICC3 ICC4 ICC5 ICC6
210 190 170 150 135 4 2 4 2 4 2 4 2 4 2
mA mA mA mA mA mA mA
1,2
TTL interface , RAS , CAS = VIH , DOUT =High-Z CMOS interface, RAS , CAS VCC-0.2V tRC = min tPC = min
RAS =VIH, CAS = VIL
210 190 170 150 135 210 190 170 150 135 5 5 5 5 5
2 1,3 1
EDO Page Mode Current Standby Current
CAS Before RAS Refresh Current
tRC = min
210 190 170 150 135
Note : 1. ICC max is specified at the output open condition. 2. Address can be changed twice or less while RAS =VIL . 3. Address can be changed once or less while CAS =VIH .
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 3/15
EliteMT
CAPACITANCE (Ta = 25 C , VCC = 5V 10%)
PARAMETER SYMBOL TYP MAX
M11B416256A
UNIT
Input Capacitance (address) Input Capacitance ( RAS , CASH , CASL , WE , OE ) Output capacitance (I/O0~I/O15)
CI1 CI2 CI / O
-
5 7 10
pF pF pF
AC ELECTRICAL CHARACTERISTICS (Ta = 0 to 70 C , VCC =5V 10%, VSS = 0V) (note 14)
Test Conditions Input timing reference levels : 0V, 3V Output reference level : VOL= 0.8V, VOH=2.0V Output Load : 2TTL gate + CL (50pF) Assumed tT = 2ns
PARAMETER
Read or Write Cycle Time Read Write Cycle Time EDO-Page-Mode Read or Write Cycle Time EDO-Page-Mode Read-Write Cycle Time Access Time From RAS Access Time From CAS Access Time From OE Access Time From Column Address Access Time From CAS Precharge
SYMBOL
-25
-28
-30
-35
-40
MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
UNIT Notes
tRC tRWC tPC tPCM tRAC tCAC tOAC tAA tACP tRAS tRASC tRSH tRP tCAS tCSH tCP tRCD tCRP tASR tRAH tRAD tASC tCAH tAR tRAL
43 65 10 32 25 8 8 12 14 25 10K
48 70 11 35 28 9 9 15 17 28 10K
55 85 12 37 30 9 9 15 17 30 10K
65 95 14 42 35 10 10 18 20 35 10K
75 105 16 47 40 11 11 20 22 40 10K
ns ns ns ns ns ns ns ns ns ns 20 22 22 4 5,20 13,20
RAS Pulse Width RAS Pulse Width (EDO Page Mode) RAS Hold Time RAS Precharge Time CAS Pulse Width CAS Hold Time CAS Precharge Time RAS to CAS Delay Time CAS to RAS Precharge Time
Row Address Setup Time Row Address Hold Time
25 100K 28 100K 30 100K 35 100K 40 100K ns 8 15 4 21 4 10 5 0 5 8 0 5 22 12 13 17 10K 9 17 5 24 4 10 5 0 5 8 0 5 24 15 13 19 10K 9 20 5 26 4 10 5 0 5 8 0 5 26 15 15 21 10K 10 25 5 30 5 10 5 0 5 8 0 5 30 18 17 25 10K 11 30 6 35 5 10 5 0 5 8 0 5 34 20 20 29 10K ns ns ns ns ns ns ns ns ns ns ns ns ns ns 8 18 18 24 19 6,23 7,18 19 25
RAS to Column Address Delay Time
Column Address Setup Time Column Address Hold Time Column Address Hold Time (Reference to
RAS )
Column Address to RAS Lead Time
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 4/15
EliteMT
(Continued)
PARAMETER
Read Command Setup Time Read Command Hold Time Reference to
M11B416256A
SYMBOL -25 -28 -30 -35 -40 UNIT Notes
MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
tRCS tRCH tRRH tCLZ tOFF1 tOFF2 tWCS tWCH tWCR tWP tRWL tCWL tDS tDH tDHR tRWD tAWD tCWD tT tREF tRPC tCSR tCHR tOEH tOES tOEHC tOEP tORD tCLCH tCOH tWHZ
0 0 0 3 3 15 6 0 5 22 5 7 5 0 5 22 34 21 17 1.5 10 5 7 4 4 2 2 0 4 3 3 7 50 8
0 0 0 3 3 15 7 0 5 24 5 7 5 0 5 24 38 25 19 1.5 10 5 7 4 4 2 2 0 5 3 3 7 50 8
0 0 0 3 3 15 8 0 5 26 5 8 6 0 5 26 46 31 25 1.5 10 10 10 4 4 2 2 0 5 3 3 7 50 8
0 0 0 3 3 15 8 0 5 30 5 9 7 0 5 30 51 34 26 2.5 10 10 10 4 4 2 2 0 5 3 3 7 50 8
0 0 0 3 3 15 8 0 5 34 5 10 8 0 5 34 56 36 27 2.5 10 10 10 5 5 2 2 0 6 3 3 7 50 8
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ns ns ns ns ns ns ns ns ns ns ns
15,18 9,15,19 9 20 10,17,2 0 17,26 11,15,1 8 15,25 15 15 15 15,19 12,20 12,20 11 11 11,18 2,3
CAS
Read Command Hold Time Reference to
RAS CAS to Output in Low-Z
Output Buffer Turn-off Delay From CAS or RAS Output Buffer Turn-off to OE Write Command Setup Time Write Command Hold Time Write Command Hold Time (Reference to RAS ) Write Command Pulse Width Write Command to RAS Lead Time Write Command to CAS Lead Time Data-in Setup Time Data-in Hold Time Data-in Hold Time (Reference to RAS )
RAS to WE Delay Time
Column Address to WE Delay Time
CAS to WE Delay Time
Transition Time (rise or fall) Refresh Period (512 cycles)
RAS to CAS Precharge Time CAS Setup Time(CBR REFRESH) CAS Hold Time(CBR REFRESH) OE Hold Time From WE During Read-Mode-Write Cycle OE Low to CAS High Setup Time OE High Hold Time From CAS High OE Precharge Time OE Setup Prior to RAS During Hidden Refresh Cycle
Last CAS Going Low to First CAS Returning High Data Output Hold After CAS Returning Low Output Disable Delay From WE
1,18 1,19 16
21
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 5/15
EliteMT
Notes :
M11B416256A
1. 2.
3.
4.
5. 6.
Enables on-chip refresh and address counters. VIH(min) and VIL(max) are reference levels for measuring timing of input signals. Transition times are measured between VIH and VIL. In addition to meet the transition rate specification, all input signals must transit between VIH and VIL in a monotonic manner. Assume that tRCD < tRCD(max). If tRCD is greater than the maximum recommended value shown in this table, tRAC will increase by the amount that tRCD exceeds the value shown. Assume that tRCD tRCD (max) If CAS is low at the falling edge of RAS , data-out will be maintained from the previous cycle. To initiate a new cycle and clear the data-out buffer, CAS and
RAS must be pulsed high.
back to VIH ) is indeterminate. OE held high and WE taken low after CAS goes low result in a LATE WRITE ( OE -controlled) cycle. 12. Those parameters are referenced to CAS leading edge in EARLY WRITE cycles and WE leading edge in LATE WRITE or READ-MODIFY- WRITE cycles. 13. During a READ cycle, if OE is low then taken HIGH before CAS goes high, I/O goes open, if OE is tied permanently low, a LATE WRITE or READ-MODIFY-WRITE operation is not possible. An initial pause of 200s is required after power-up followed by eight RAS refresh cycles ( RAS only or CBR) before proper device operation is assured. The eight RAS cycle wake-ups should be repeated any time the tREF refresh requirement is exceeded. WRITE command is defined as WE going low. LATE WRITE and READ-MODIFY-WRITE cycles must have both tOFF2 and tOEH met ( OE high during WRITE cycle) in order to ensure that the output buffers will be open during the WRITE cycles. The I/Os open during READ cycles once tOFF1 or tOFF2 occur. Referenced to the earlier CAS falling edge.
14.
7.
8.
9. 10. 11.
Operation within the tRCD limit ensures that tRCD (max) can be met, tRCD (max) is specified as a reference point only ; if tRCD is greater than the specified tRCD (max) limit, access time is controlled by tCAC. Operation within the tRAD limit ensures that tRAD(max) can be met. tRAD(max) is specified as a reference point only ; if tRAD is greater than the specified tRAD (max) limit, access time is controlled by tAA. Either tRCH or tRRH must be satisfied for a READ cycle. tOFF1(max) defines the time at which the output achieves the open circuit condition ; it is not a reference to VOH or VOL. tWCS, tRWD, tAWD and tCWD are restrictive operating parameters in LATE WRITE and READ-MODIFY-WRITE cycle only. If tWCS tWCS(min) , the cycle is an EARLY WRITE cycle and the data output will remain an open circuit throughout the entire cycle. If tRWD tRWD(min) , tAWD tAWD(min) and tCWD tCWD(min) , the cycle is READ-WRITE and the data output will contain data read from the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until CAS and RAS or OE go
15. 16.
17. 18.
19. Referenced to the latter CAS rising edge. 20. Output parameter (I/O) is referenced to corresponding CAS input, IO0~7 by CASL and IO8~15 by
CASH .
21. Last falling CAS edge to first rising CAS edge. 22. Last rising CAS edge to next cycle's last rising
CAS edge.
23. Last rising CAS edge to first falling CAS edge. 24. Each CAS must meet minimum pulse width. 25. Referenced to the latter CAS falling edge. 26. All IOs controlled by OE , regardless CASL and
CASH .
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 6/15
EliteMT
TRUTH TABLE
ADDRESSES
M11B416256A
FUNCTION
RAS H L L L L L
CASL CASH HX L L H L L HX L H L L H
WE X H H H L L
OE X L L L X X
ROW X ROW ROW ROW ROW ROW
COL X COL COL COL COL COL High-Z Data-Out
DQS
NOTES
Standby Read : Word Read : Lower Byte Read : Upper Byte Write : Word (Early Write) Write : Lower Byte (Early)
Lower Byte, Data-Out Upper Byte, Data-Out Data-In Lower Byte, Data-In , Upper Byte, High-Z Lower Byte, High-Z , Upper Byte, Data-In Data-Out, Data-In Data-Out Data-Out Data-Out 1, 2 2 2 2 1 1 1, 2 1, 2 2
Write : Upper Byte (Early) Read-Write 1st Cycle EDO-Page-Mode 2nd Cycle Read Any Cycle EDO-Page-Mode 1st Cycle Write 2nd Cycle EDO-Page-Mode 1st Cycle Read-Write 2nd Cycle Hidden Refresh
RAS -Only Refresh
L L L L L L L L L LHL L HL
H L HL HL LH HL HL HL HL L H L
L L HL HL LH HL HL HL HL L H L
L
X
ROW ROW ROW
COL COL COL COL
HLLH H H H L L L L L X X
ROW
COL COL
Data-In Data-In Data-Out, Data-In Data-Out, Data-In Data-Out High-Z
HLLH HLLH H X H L X X
ROW
COL COL
ROW ROW X
COL
CBR Refresh
X
High-Z
3
*Note : 1. These WRITE cycles may also be BYTE WRITE cycles (either CASL or CASH active). 2. These READ cycles may also be BYTE READ cycles (either CASL or CASH active). 3. Only one CAS must be active ( CASL or CASH ).
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 7/15
EliteMT
READ CYCLE
tRC tRAS
VIH RAS VIL
M11B416256A
tRP tCSH tRSH tCAS
tRRH tCLCH
tCRP
CASL ,CASH VIH VIL
tRCD
tAR tASR
ADDR VIH VIL ROW
tRAD tRAH
tASC
tRAL tCAH
COLUMN ROW
tRCS
WE VIH VIL
tRCH
tAA tRAC tCAC tCLZ
I/O VO H VO L OPEN
tOFF1
NO TE 1
VAL ID DATA
OPEN
tO AC
OE VIH VIL
tOFF2
EARLY WRITE CYCLE
tRC tRAS
RAS VIH VIL
tRP tCSH tRSH t CAS tCLCH
tCRP
CASL ,C ASH VIH VIL
tRCD
tAR tASR
ADDR VIH VIL ROW
tRAD tRAH
tASC
COLUMN
tRAL tCAH
ROW
tWCS
tCWL tRWL tWCR tWCH tWP
WE
VIH VIL
tDS
I/O VIH VIL VIH VIL
tDHR tDH
VAL ID D ATA
OE
DON'T CARE UNDEFINED
Note: 1. tOFF1 is referenced from the rising edge of RAS or CAS , whichever occurs last.
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 8/15
EliteMT
READ WRITE CYCLE (LATE WRITE and READ-MODIFY-WRITE CYCLES)
tRWC t RAS
RAS VIH VIL
M11B416256A
tRP tCSH tRS H t CAS
tCRP
CASL,CASH VIH VIL
tRCD
tCLCH
tASR
ADDR VIH VIL ROW
tAR tRAD tRAH
tASC
COLUMN
t RAL t CAH
ROW
tRCS
VIH VIL
tRWD tCWD tAWD
tCWL tRWL tWP
WE
tAA tRAC tCAC tCLZ
I/O VI/O H VI/O L OPEN VAL ID DO UT
tDS
tDH
VALI D DIN
tO AC
OE VIH VIL
tOFF 2
tOEH
EDO-PAGE-MODE READ CYCLE
tRASC
RAS VIH VIL
tRP
tCRP
CASL ,C AS H VIH VIL
tCSH tRCD
tPC tCAS ,t CLCH tCP
(NOTE2)
tCAS, t CLCH
tCP
tRSH tCAS, t CLCH
tCP
tAR t RAD tASR tRAH
ADDR VIH VIL ROW
tRAL t AS C tCAH
COLUMN
tASC
t CAH
tASC
tCAH
ROW
COLUMN
COLUMN
tRCS
WE VIH VIL
tRCH
tRRH
tAA tRAC tCAC tCLZ
I/O VO H VO L OPEN
tAA t ACP tCAC tCOH
VAL ID D ATA
VALID DATA
tAA tACP tCAC tCLZ tOEHC tO AC tOFF 2 tOES tOEP
VAL ID D ATA NO TE1
tOFF1
OPEN
tO AC tOES
tOFF 2
OE
VIH VIL
DON'T CARE
UNDEFINED
*NOTE : 1. tOFF1 is referenced from the rising edge of RAS or CAS , whichever occurs last. 2. tPC can be measured from falling edge of CAS to falling edge of CAS , or from rising edge of CAS to rising edge of CAS . Both measurements must meet the tPC specification.
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 9/15
EliteMT
EDO-PAGE-MODE EARLY-WRITE CYCLE
tRASC
RAS VIH VIL
M11B416256A
tRP
tCSH tCRP
CASL ,CASH VIH VIL
tRCD
tCAS, tCLCH
tPC (NOTE1) tCAS,tCLCH tCP
tCP
tRSH tCAS,tCLCH
tCP
tAR tRAD tASR
ADDR VIH VIL
tRAH
tASC
tCAH
COLUMN
tASC tCAH
COLUMN
tASC
tRAL tCAH
ROW
ROW
COLUMN
tCWL tWCS tWCH tWP tWCS
tCWL tWCH tWP
tWCS
tCWL tWCH tWP
WE
VIH VIL
tDS
I/O VIH VIL
tWCR tDHR tDH
tRWL tDS tDH tDS tDH
VAL ID DATA
VAL ID DATA
VAL ID DATA
OE
VIH VIL
EDO-PAGE-MODE READ-WRITE CYCLE (LATE WRITE and READ-MODIFY-WRITE CYCLES)
tRASC
RAS VIH VIL
tRP
tCSH tCRP
CASL ,CASH VIH VIL
tRCD
tCAS, tCLCH
tCP
tPCM tCAS, tCLCH
tRSH tCP tCAS,tCLCH tCP
tAR tRAD tASR
ADDR VIH VIL
tRAH
tASC
tCAH
tASC
tCAH
tASC
tRAL tCAH
ROW
ROW
COLUMN
COLUMN
COLUMN
tRWD tRCS tCWL tWP tCWL tWP
tRWL tCWL tWP
tAWD tCWD
WE VIH VIL
tAWD tCWD
tAWD tCWD
tAA tRAC tCAC tCLZ tDH tDS
tAA tACP tCAC tCLZ
VALI D VALI D DOUT DIN VALI D VALI D DOUT D IN
tAA tDH tDS tCAC tCLZ
VALID VALI D DOUT DIN
tACP tDS
tDH
I/O
VI/O H VI/O L
tOFF2 tO AC
OE VIH VIL
tOFF2 tO AC tO AC
tOFF2 tOEH
DON'T CARE
UNDEFINED
Note : 1. tPC can be measured from falling edge to falling edge of CAS , or from rising edge to rising edge of CAS . Both measurements must meet the tPC specification.
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 10/15
EliteMT
EDO-PAGE-MODE READ-EARLY-WRITE CYCLE (Psuedo READ-MODIFY-WRITE)
tRAS C
RAS VIH VIL
M11B416256A
tRP
tCSH tCRP
CAS VIH VIL
tRCD
tPC tCAS
tCP tCP tCAS tCP
tRSH tCAS
tCP
tAR tRAD tAS R tRAH
ADDR VIH VIL ROW
tRAL tCAH tASC tCAH tASC tCAH
ROW
tASC
COLUMN(A)
COLUMN(B)
COLUMN(N)
tRCS
WE VIH VIL
tRCH
tWCS
tWCH
tAA tRAC tCAC tACP
tAA tW HZ tCAC tCOH
VAL ID DATA( A)
VALID DATA(B )
tDS
tDH
I/O
VI/OH VI/OL
OPE N
VALID DATA IN
tO AC
OE
VIH VIL
RAS ONLY REFRESH CYCLE (ADDR = A0~A8 ; OE , WE = DON'T CARE)
tRC tRAS
RAS VIH VIL
tRP
tCRP
CASL ,C AS H VIH VIL
tRPC
tASR
ADDR VIH VIL ROW
tRAH
ROW
I/O
VO H VO L
OPE N
DON'T CARE UNDEFINED
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 11/15
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CBR REFRESH CYCLE (A0~A8 ; OE = DON'T CARE)
tRP
RAS VIH VIL
M11B416256A
tRAS
tRP
tRAS
tRPC tCP
CASL ,C AS H VIH VIL
tCSR
tCHR
tRPC
tCSR
tCHR
I/O
OPEN
WE
VIH VIL
tRCH
HIDDEN REFRESH CYCLE ( WE = HIGH ; OE = LOW)
(READ) (REF RESH)
tRAS
RAS VIH VIL
tRP
tRAS
tCRP
CASL ,C AS H VIH VIL
tRCD
tRSH
tCHR
tAR tRAD tASR tRAH
ROW
tASC
tRAL tCAH
ADDR
VIH VIL
COLUMN
tAA tRAC tCAC tCLZ
I/O VO H VO L OPEN VALID DATA
NO TE1
tOFF1
OPEN
OE
VIH VIL
tO AC tORD
tOFF2
DON'T CARE
UNDEFINED
Note : 1. tOFF1 is reference from the rising edge of RAS or CAS , whichever occurs last.
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 12/15
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PACKING 40-LEAD SECTION
40
M11B416256A
DIMENSIONS SOJ(400mil) I
D 21
0.050" Max.
b
2
E1 E
b
Detail "A"
1 20
c A2
Detail "A"
Seating Plain
e
A A1
0.024" Min.
1
E
R
2
1
SECTION
40
II
D 21
0.050" Max.
b
2
E1 E
b
Detail "A"
1 20
c A2
Detail "A"
Seating Plain
e
A A1
0.024" Min.
1
E
R
2
1
Symbol A A1 A2 b b2 c e
Dimension in mm Min Norm Max 3.250 3.510 3.760 2.080 2.790 REF 0.380 0.460 0.560 0.635 REF 0.180 0.250 0.360 1.270 BSC
Dimension in inch Symbol Dimension in mm Min Norm Max Min Norm Max 0.128 0.138 0.148 E 10.920 11.176 11.430 0.082 E1 10.030 10.160 10.290 0.110 REF E2 9.40 BSC 0.015 0.018 0.022 R1 0.760 0.890 1.020 0.025 REF 1 0 10 0.007 0.010 0.014 0.050 BSC D 25.91 26.040 26.290
Dimension in inch Min Norm Max 0.430 0.440 0.450 0.395 0.400 0.405 0.370 BSC 0.030 0.035 0.040
0
1.02 1.025
10
1.035
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 13/15
EliteMT
PACKING 40 / 44-LEAD DIMENSIONS TSOP(II) DRAM(400mil)
M11B416256A
Symbol A A1 A2 b b1 c c1 D ZD E E1 L L1 e
Dimension in mm Min 0.05 0.95 0.30 0.30 0.12 0.10 18.28 11.56 10.03 0.40 18.41 0.805 REF 11.96 10.29 0.69 11.76 10.16 0.59 0.80 REF 0.80 BSC O ~ 7 REF 0.35 1.00 Norm Max 1.20 0.15 1.05 0.45 0.40 0.21 0.16 18.54
Dimension in inch Min 0.002 0.037 0.012 0.012 0.005 0.004 0.720 0.455 0.395 0.016 0.725 0.0317 REF 0.463 0.400 0.023 0.031 REF 0.0315 BSC O ~ 7 REF 0.471 0.4 0.027 0.014 0.039 Norm Max 0.047 0.006 0.042 0.018 0.016 0.008 0.006 0.730
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 14/15
EliteMT
Important Notice All rights reserved.
M11B416256A
No part of this document may be reproduced or duplicated in any form or by any means without the prior permission of EliteMT. The contents contained in this document are believed to be accurate at the time of publication. EliteMT assumes no responsibility for any error in this document, and reserves the right to change the products or specification in this document without notice. The information contained herein is presented only as a guide or examples for the application of our products. No responsibility is assumed by EliteMT for any infringement of patents, copyrights, or other intellectual property rights of third parties which may result from its use. No license, either express , implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of EliteMT or others. Any semiconductor devices may have inherently a certain rate of failure. To minimize risks associated with customer's application, adequate design and operating safeguards against injury, damage, or loss from such failure, should be provided by the customer when making application designs. EliteMT's products are not authorized for use in critical applications such as, but not limited to, life support devices or system, where failure or abnormal operation may directly affect human lives or cause physical injury or property damage. If products described here are to be used for such kinds of application, purchaser must do its own quality assurance testing appropriate to such applications.
Elite Memory Technology Inc
Publication Date : Feb. 2004 Revision : 1.9 15/15


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